Platform · Immersion Cooling

Liquid logic for the
GPU era.

Single-phase dielectric immersion cooling, certified Tier III. The Kingdom's first commercially available immersion platform — engineered for racks the air-cooled world can't touch.

Immersion cooling tank with submerged GPU servers

The physics

Why dielectric fluid solves what air cannot.

Dielectric coolants conduct heat 1,200× more efficiently than air. By submerging compute hardware in a non-conductive thermal fluid, we eliminate fans, hot spots, and the thermal throttling that caps GPU performance. The result: rack densities up to 100 kW, PUE values approaching 1.05, and zero evaporative water consumption.

  • No fans. No moving parts inside the pod means lower failure surface and quieter halls.
  • No hot spots. The thermal envelope is uniform across the rack — every chip sees the same temperature.
  • No throttling. GPUs run at sustained boost clocks that air-cooled environments cannot maintain.
  • No water. Closed-loop dielectric circulation eliminates evaporative consumption entirely.
  • Less power. Cooling overhead drops from ~30% of facility load to ~5%.

Technical specifications

What you're committing to.

Production specifications across active immersion deployments in our Riyadh and Olaya facilities.

Immersion · Production Specs
Cooling fluid
Single-phase dielectric
Rack density
Up to 100 kW
Annualized PUE
1.05–1.08
Water consumption
Zero (closed loop)
Heat reuse
Available on request
Certifications
Uptime Tier III · ASHRAE-aligned
Maintenance window
Live-serviceable pods
Pod sizes
24U · 48U
Compatible hardware
NVIDIA H100/H200/B200, AMD MI300, custom ASIC

Pod architecture

Inside an immersion pod.

The mechanical and instrumentation system designed around the submerged compute envelope.

Pod tank

Sealed dielectric reservoir housing the submerged compute. Stainless construction, leak-detected.

Coolant Distribution Unit

Pumps and circulates dielectric through the pod and out to the heat exchanger.

Heat exchanger

Transfers heat from the dielectric loop to the facility chilled-water loop. Plate-and-frame, redundant.

Submerged compute

Servers operate fully submerged, fans removed, with thermal envelope unconstrained by air boundary layers.

Telemetry

Temperature, flow, conductivity, and leak sensors stream into Finblade for predictive maintenance.

Dry disconnect service port

Live-service interface lets technicians lift, service, and reseat servers without draining the pod.

“We didn’t retrofit immersion onto an air-cooled hall. We engineered the entire facility envelope — power, plumbing, fire suppression, monitoring — for liquid from day one.”
AM
Ahmad Mansour
Executive Director, Engineering

Cooling comparison

Air vs. DTC vs. Immersion.

A side-by-side of the three cooling architectures we operate.

DimensionAir-cooledDirect-to-ChipImmersion
Max rack density20 kW80 kW100 kW
Annualized PUE1.301.121.06
Water consumptionModeratePartial loopZero
Deployment complexityLowMediumHigh (engineered)
GPU supportA100 / L40H100 / H200H100 / H200 / B200
Acoustic profileLoudModerateSilent

Capacity is being committed daily.
Reserve yours.

Tour the facility. Talk to engineering. Get a precision quote. We respond to qualified inquiries within one business day.

Olaya District, Riyadh · Open for tours by appointment